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Conference Schedule: Click here to open.

Instructions for presenters (oral and poster): Click here to open.


MONDAY, 9 MAY 2016

08:00 Registration opens

08:40 - 09:00 Opening Ceremony

Chair: S. Grivet-Talocia

09:00 - 09:50 Keynote

Evolution of the Smart Power and High Voltage Technologies, Design and Simulations (slides)

Giulio Ricotti

STMicroelectronics, Italy

09:50 - 10:30 Session 1: Behavioral Modeling

Chair: I. Maio, I. Stievano

09:50 - 10:10

Robust nonlinear models for CMOS buffers (slides)

C. Diouf (1), M. Telescu (2), N. Tanguy (2), I.S. Stievano (3), F.G. Canavero (3)

(1) École Nationale d'Ingénieurs de Brest, France; (2) Université de Bretagne Occidentale, France; (3) Politecnico di Torino, Italy

10:10 - 10:30

Discrete controlled pre-driver FIR model for hybrid IBIS model AMS simulation (slides)

W. Dghais (1), F.H. Bellamine (2)

(1) Université de Sousse, Tunisia; (2) Université de Carthage, Tunisia

10:30 - 11:00 Coffee break

10:30 Exhibition opens

11:00 - 11:40 Session 2: Measurements and Characterization

Chair: H. Grabinski, E. Griese

11:00 - 11:20

Characterization of high-frequency interconnects: comparison between time- and frequency-domain methods

M. Bieler, U. Arz

Physikalisch-Technische Bundesanstalt Braunschweig, Germany

11:20 - 11:40

Signal propagation properties of anisotropic conducting polymers up to 110 GHz and their applicability in test fixtures (slides)

M. Sippel, G. Gold, K. Helmreich

Friedrich-Alexander-University Erlangen-Nuremberg, Germany

11:40 - 12:40 Session 3: Optical and Nano Interconnects

Chair: M. Telescu, Z. Zhang

11:40 - 12:00

An adjoint method based approach for optical waveguide design in thin glass sheets using ion-exchange processes (slides)

D. Zhang, T. Kühler, E. Griese

University of Siegen, Germany

12:00 - 12:20

Electrothermal modeling and characterization of carbon interconnects with negative temperature coefficient of the resistance (slides)

A. Maffucci (1), F. Micciulla (2), A. Cataldo (2), S. Bellucci (2), G. Miano (3)

(1) University of Cassino and Southern Lazio, Italy; (2) INFN-LNF Frascati, Italy; (3) University Federico II, Italy

12:20 - 12:40

Propagation of surface plasmon polaritons on graphene nano-interconnects

R. Araneo (1), G. Lovat (1), S. Celozzi (1), P. Burghignoli (1), G. W.Hanson (2)

(1) Sapienza University of Rome, Italy; (2) University of Wisconsin-Milwaukee, USA

12:40 - 14:00 Lunch break

14:00 - 15:20 Session 4: Stochastic Analysis and Uncertainty Quantification

Chair: M. Nakhla, P. Manfredi

14:00 - 14:20

Impact of continuous time linear equalizer variability on eye opening of high-speed links (student paper)

J.B. Preibisch, T. Reuschel, K. Scharff, C. Schuster

Technische Universität Hamburg-Harburg, Germany

14:20 - 14:40

Hyperbolic polynomial chaos expansion (HPCE) and its application to statistical analysis of nonlinear circuits (slides)

M. Ahadi, A. Krishna Prasad, S. Roy

Colorado State University, USA

14:40 - 15:00

A big-data approach to handle process variations: uncertainty quantification by tensor recovery (slides)

Z. Zhang, T.-W. Weng, L. Daniel

Massachusetts Institute of Technology, USA

15:00 - 15:20

Application of Taylor models to the worst-case analysis of stripline interconnects (slides)

P. Manfredi (1), R. Trinchero (2), F.G. Canavero (3), I.S. Stievano (3)

(1) Ghent University, Belgium; (2) Istituto Nazionale di Fisica Nucleare (INFN) – Sezione di Torino, Italy; (3) Politecnico di Torino, Italy

15:20 - 17:30 Poster session (includes coffee break)

Chair: U. Arz, S. Lefteriu

High-speed flip chip package co-design with optimization of anti-pad size variations on metal plane layout

H.J. Lim (1), J.K. Yang (2), H.Y. Ku (2), C.G. Ahn (2), T.Y. Lee (2), B.J. Kim (2), J.Y. Chung (2)

(1) Amkor Technology Inc., South Korea; (2) Amkor Technology Inc., USA

Eye-diagram estimation using equivalent circuit model of coupled microstrip channel on high-speed and wide I/O channel for 2.5D and 3D IC (student paper)

S. Choi, H. Kim, D.H. Jung, J.J. Kim, J. Lim, H. Lee, K. Cho, J. Kim

Korea Advanced Institute of Science and Technology, South Korea

Pole residue equivalent system solver (PRESS)

V. Avula, A. Zadehgol

University of Idaho, USA

An analysis of power supply induced jitter for a voltage mode driver in high speed serial links

J.N. Tripathi (1), V.K. Sharma (2), H. Advani (3), P.N. Singh (1), H. Shrimali (2), R. Malik (1)

(1) STMicroelectronics, India; (2) Indian Institute of Technology Mandi, India; (3) Synopsys Inc., India

Power-aware signal integrity analysis of DDR4 data bus in onboard memory module

A.K. Pandey

Keysight Technologies, India

Achievements and challenges in power and signal integrity analyses of set-top box products

X. Lecoq, E. Terlain, E. Dralez, D. Auchere

STMicroelectronics, France

System-level practical dynamic voltage drop simulation with IC internal VRM

J. Jo, S. Kim, S. Lee, S. Pae

Samsung Electronics

Accurate prediction of interconnect capacitance in self-aligned quadruple patterning

T. Kanamoto (1,6), H. Ammo (2,6), T. Hasegawa (3,6), S. Kobayashi (4,6), T. Fukuda (4,6), M. Kawano (5,6)

(1) Renesas System Design, Japan; (2) Sony, Japan; (3) Sony LSI Design, Japan; (4) Toshiba, Japan; (5) Ricoh, Japan; (6) JEITA EDA Technical Committee, Japan

Frequency dependent and nonuniform parameters transmission line model

A. Wardzinska, W. Bandurski

Poznan University of Technology, Poland

A new EMI-noise reduction method in LSI-package-board system

T. Hasegawa (1,7), T. Kanamoto (2,7), H. Ammo (3,7), M. Kawano (4,7), T. Fukuda (5,7), S. Kobayashi (5,7), A. Kurokawa (6,7)

(1) Sony LSI Design, Japan; (2) Renesas System Design, Japan; (3) Sony, Japan; (4) Ricoh, Japan; (5) Toshiba, Japan; (6) Hirosaki University, Japan; (7) JEITA EDA Technical Committee, Japan

Power delivery network simulation methodology including integrated circuit behavior

B. Goral (1), C. Gautier (1), A. Amedeo (2)

(1) Ecole Normale Supérieure de Cachan, France; (2) Thales Communication and Security, France

Common-mode noise reduction of right-angled coupled stripline using timing-offset differential signal

C.-C. Yeh, C.-L. Wang

National Taiwan University of Science and Technology, Taiwan

Fast transient thermal simulation of 2.5-D packages on through silicon via interposer (student paper)

Q. Feng, M. Tang, G. Fu, J. Mao

Shanghai Jiao Tong University, China

Generalized anisotropic polynomial chaos approach for expedited statistical analysis of nonlinear radio-frequency (RF) circuits

I. Kapse, A. Krishna Prasad, S. Roy

Colorado State University, USA

On the use of digital predistortion to compensate the nonlinear effects of semiconductor optical amplifiers

S. Azou (1), S. Bejan (1), P. Morel (1), C. Diouf (1), A. Sharaiha (1), M. Telescu (2), N. Tanguy (2)

(1) École Nationale d’Ingénieurs de Brest, France; (2) Université de Bretagne Occidentale, France

System level estimation of a PCB electromagnetic radiated emission

S. Heidari, M. Mehri, N. Masoumi

University of Tehran, Tehran, Iran

The analysis of EMI effects on the performance of electronic systems implemented on a PCB

M. Mehri, S. Heidari, N. Masoumi

University of Tehran, Tehran, Iran

Addressing PCB effects in the design of a buck converter

I. Erdin (1), R. Achar (2)

(1) Celestica Inc., Canada; (2) Carleton University, Canada

Filter design method for GaN-Buck converter taking into account of the common-mode propagation paths

J.L. Kotny, T. Duquesne, N. Idir

Université de Lille, France

High-frequency modelling of surface-mount power inductor used in switching dc-dc converters (student paper)

J. Bacmaga (1), R. Blecic (1,2), R. Gillon (3), A. Baric (1)

(1) University of Zagreb, Croatia; (2) KU Leuven, Belgium; (3) ON Semiconductor, Belgium

Analysis of coupled exponential microstrip lines by means of a multi-step perturbation technique

P. Manfredi, D. De Zutter, D. Vande Ginste

Ghent University/iMinds, Belgium

Adaptive algorithm for sampling nonlinear circuit behaviour in time-domain (student paper)

M. Magerl (1), C. Stockreiter (2), O. Eisenberger (2), A. Baric (1)

(1) University of Zagreb, Croatia; (2) ams AG, Austria

Optical directional coupler for graded index waveguides in thin glass sheets for PCB integration

J.H. Stosch, T. Kühler, E. Griese

University of Siegen, Germany

Radiation of synchronous buck converter modelled by three magnetic moments and combined with SPICE simulations (student paper)

R. Blecic (1,2), R. Gillon (3), B. Nauwelaers (2), A. Baric (1)

(1) University of Zagreb, Croatia; (2) KU Leuven, Belgium; (3) ON Semiconductor, Belgium

Finite difference schemes for transient simulation of transmission lines exhibiting uncertainties

X. Chen, J.E. Schutt-Ainé, A.C. Cangellaris

University of Illinois at Urbana-Champaign, USA

High-Fidelity, high-performance full-wave computational algorithms for intra-system EMI analysis of IC and electronics

S. Lin, H.-W. Gao, Z. Peng

University of New Mexico, USA

Characterize server platform voltage regulator performance beyond power conversion

J. He, W. Xu, C. Guo, D. Figueroa

Intel Corporation, USA

17:30 Exhibition closes

18:30 Social event